22 Minute Webinar : Overcome Thermal Challenges in Electronic equipment – SOLIDWORKS® Flow Simulation

27 July 2016 | 11:00 a.m. – 11:30 a.m.

WHAT: Understand how Flow Simulation can help in dissipating the heat out of Electronic enclosures efficiently.

Who should attend? Electronics enclosure designers, Product Engineers

In just 22 minutes, learn how SOLIDWORKS®Flow Simulation can help you:
• Efficient thermal dissipation from electronic enclosures

Speaker Profile
Kapil has more than 15 years of experience in the field of Design Analysis and has helped many designers implement Simulation solution in their Design cycle.